for embossing

[font=&quot] [/font][font=&quot]A technique similar to hot embossing has been used to pattern very fine features into thermal plastic polymers. In this process, both the mold and the polymer-casted substrate are silicon wafers with a typical thickness of 0.5 mm and diameter of 100 mm. Under an elevated temperature (e.g. 175 C), the mold and the substrate will be pressed against each other with uniform pressure across the whole wafer. The goal of the project is to design an apparatus for such a process. The idea is to build a chamber that can be pressurized using either air or fluid as a medium (the pressure needed is up to 2 x 10^6 Pa). The mold and the substrate can then be put into the chamber, heated to a specified temperature and pressed together when the chamber is pressurized. Such a scheme gives very uniform pressure by virtue of hydraulic press. After the samples are cooled down, the pressure can be released, and the mold and the substrate are separated, thus finishing the imprint process. This project will involve design experience in pressure chamber, vacuum sealing, heating element and heat conduction. The finished tool will expose the team members to one important aspect of the microelectronic processing, i.e. high-resolution lithography.[/font]

Are you lost?

I really hate it when my team members are exposed.

I'd use a plc2 connected to a 3-phase dc Westinghouse drive.